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AMP5085

AMP5085

12U PICMG® 2.16
Advanced Managed Platform™

HIGHLIGHTS:

  • 12U, PICMG® 2.16 19-in. Rack-Mount Enclosure
  • 21 Hot-Swappable, Standards-Based Slots
    - 18 node slots
    - Two 10/100/1000 PICMG 2.16 redundant fabric slots
    - Two 3U redundant PICMG 2.9 IPMI-based ISM slots
  • Intelligent Shelf Managers
  • Dual Gigabit or 10/100 Ethernet Switches
  • Midplane Configuration:
    - Two CompactPCI bus segments with 32/64-bit, 33Hz bus support
    - Operate as 18 independent PICMG 2.16 node slots
    - Single H.110 telephony bus
    - 21 rear panel I/O slots (18 node slots, two fabric slots, and one ISM RTM slot)
  • Up to 1300W Total Power and Cooling
    - Redundant hot-swappable fan trays
    - Redundant hot-swappable N+N power supply architecture
    - Isolated power inputs (no OR’ing diodes)
  • IPMI Star Topology for Increased Reliability and Security
  • All Field-Replaceable Units (FRUs) Serviceable from the Front (except RTMs)
  • Designed for NEBS Level 3 and ETSI Installations
  • Five-Nines (99.999%) Availability

The AMP5085 Advanced Managed Platform™ features a PICMG® 2.16-compatible midplane, which provides OEM equipment designers with a flexible, high-availability computing platform for mission-critical applications.

The AMP5085 CompactPCI® platform supports five-nines (99.999%) availability with built-in redundancy for active system components including system master CPU boards, Ethernet switches, intelligent shelf managers (ISMs), power supplies, and fan trays. Redundant ISMs enable customers to manage multiple IPMI-based components in the platform and conduct comprehensive diagnostics remotely for enhanced system reliability. Ethernet signals are routed across the midplane without the use of cables, which saves time in setup, maintenance, and repair and minimizes the challenges of traditional cabling methods.

Midplane Configuration and Details

The AMP5085 platform is flexible and can accommodate multiple configurations. It can be configured as two independent PCI Bus segments, each with up to two dedicated system masters. There are a total of 18 PICMG 2.16 slots, 12 of which support a single H.110 us spanning slots three through eight and 13 through 18. All slots support IEEE 1101.11-style, 80 mm-deep transition cards in the rear panel I/O section directly behind the midplane. Each node and fabric slot may be independently configured for 3.3 V or 5 V VI/O operation.

Figure 1: Component Layout for AMP5085 platform
Component layout for AMP5085 platform

Intelligent Shelf Manager

The AMP5085 platform includes two redundant CPC7301 Intelligent Shelf Managers (ISMs) operating in active/standby mode. It implements the PICMG 2.9 specification for a standardsbased interface, which allows management of third-party, IPMI-based products within a PICMG 2.16-compliant platform. The ISM software interfaces are comprehensive, including a Web-based GUI, a command line interface (CLI), SNMP, and more. It communicates with components in the AMP5085 via point-to-point IPMB busses in a unique star topology to achieve secure, comprehensive, highly available management.

Ethernet Switching

Standard AMP5085 platforms come configured with a choice of Performance Technologies’ award-winning switches: either dual CPC4416 24-port 10/100 + 2-Port Gb TX switches or dual CPC6600 24-port 10/100/1000 TX switches. Other switching options are also available.

Redundant Power Subsystems

The AMP5085 supports an N+N redundant, scalable power solution with up to eight standard 3U x 8HP power supplies. The power supplies are divided into two separate power subsystems, each housing four power supplies and receiving input power from redundant DC or AC inputs. This is critical in central office locations where two independent power feeds deliver redundant DC input into high-availability systems. The two power subsystems maintain isolation of these inputs (no diode OR’ing) and provide protection so that failure of one power input will not affect the other.

The two power subsystems maintain isolation of these inputs (no diode OR’ing) and provide protection so that failure of one power input will not affect the other.

Figure 2: AMP5085 platform redundant power-input architecture
The AMP5085 platform redundant power-input architecture

Cooling Architecture

With 250 W power supplies, the AMP5085 platform supports more than 40 W per slot. When scaled to 300 W AC or 325 W DC power supplies, the AMP5085 powers and cools up to 50 W per node slot and 80 W per fabric slot. The platform houses three hot-swappable fan trays, which are serviceable from the front. Each tray includes three blowers and spans the distance from front to back of the chassis. The front blower cools the front card cage area, and the rear blower cools the power supplies and rear of the card cage. The middle blower cools both areas, providing N+1 redundant cooling for the entire chassis (see figure below).

Figure 3: Cross Section/Side View of the AMP5085 Platform
Cross section/side view of the AMP5085 platform

Technical Specifications

The AMP5085 is compliant with the following specifications:

  • CompactPCI core specification, PICMG 2.0, R2.1
  • CompactPCI hot-swap specification, PICMG 2.1, R2.0
  • CompactPCI system management specification, PICMG 2.9, R1.0
  • CompactPCI power interface specification, PICMG 2.11,R1.0
  • CompactPCI packet switching backplane specification, PICMG 2.16, R1.0
  • IPMI specification, version 1.5
  • Standard CompactPCI keying

Power

Input

  • AC input: 110 to 220 V AC (50 to 60 Hz)
  • DC input: -36 to -60 V DC

Output

Power Supplies +5 V +5 V +12 V -12 V
Eight 325 W
DC supplies (4+4)
120 A 160 A 20 A 4 A
Eight 300 W
AC supplies (4+4)
120 A 160 A 20 A 2 A
Eight 250 W
AC supplies (4+4)
160 A* 160 A* 22 A 6 A

* CPC6303 AC power supply; the 5 V and 3.3 V rails share current.

Physical

  • Height: 12U, 533 mm (21-in.)
  • Width: 436 mm (17.2-in.) without rack-mount flanges. Rack-mount flanges allow mounting to 19-in. racks.
  • Depth: 431 mm (17-in.)
  • Weight: 44.2 kg (97.5 lb)

Note: To provide proper cooling to the AMP5085, each unused slot in the chassis should be populated with an air management blade. All rear slots should be populated with a rear filler panel. See the list below for orderable components:

  • To cover a single rear panel slot, use a filler panel that is 6U x 4HP (horizontal pitch = 0.2-in.) (PT-ACC 5040-12059).
  • To cover six rear panel slots, use a filler plate that is 6U x 24HP (PT-ACC 5043-12062).
  • To fill a front slot, use an air management blade that is 6U x 4HP (PT-ACC 5031-12064).
  • To fill a power supply bay, use an air management blade that is 3U X 8HP (PT-ACC 5030-12063).
  • To fill an ISM slot, use a filler panel that is 3U X 4HP (PT-ACC 5044-12155).

Regulatory Compliance

  • Designed for NEBS Level 3 and ETSI Installations

Safety

  • UL/cUL 60950 Safety for Information Technology Equipment E179737
    - UL File Number E179737
  • EN/IEC 60950 Safety for Information Technology Equipment
  • CB Certificate and Report Scheme
  • CE Certificate

Emissions Test Regulations

  • FCC, Class B
  • EN 55022/CISPR 22 Class B Radiated and Conducted Emissions Tests
  • EN 55024/CISPER 24
  • EN-61000-3-2 Power Line Harmonic Emissions
  • EN-61000-3-3 Power Line Fluctuation and Flicker
  • EN-61000-4-2 Electro-Static Discharge (ESD)
  • EN-61000-4-3 Radiated Susceptibility
  • EN-61000-4-4 Electrical Fast Transient Burst
  • EN-61000-4-5 Power Line Surge
  • EN-61000-4-6 Frequency Magnetic Fields
  • EN-61000-4-11 Voltage Dips, Variation and

Short Interruptions Network Equipment-Building System (NEBS) Requirements

  • GR-1089-CORE
    - Sect. 2 Electrical Discharge
    - Sect. 3.2.2 Radiated RF Emissions
    - Sect. 3.2.3 AC Line Conducted Emissions-Voltage
    - Sect. 3.2.4 AC & DC Line Conducted Emissions-Current
    - Sect. 3.3.1 RF Radiated Fields
    - Sect. 3.3.3 RF Common Mode
  • GR-63-CORE issue 1
    - Sect. 5.1.1.1 Low-Temperature Exposure and Thermal Shock
    - Sect. 5.1.1.2 High-Temperature Exposure and Thermal Shock
    - Sect. 5.1.1.3 High Relative Humidity Exposure
    - Sect. 5.3.1 Handling Drop Tests-Packaged Equipment
    - Sect. 5.3.2 Unpackaged Equipment Drop Tests
    - Sect. 5.4.1 Earthquake Tests
    - Sect. 5.4.2 Office Vibration Test Procedure
    - Sect. 5.4.3 Transportation Vibration-Packaged Equipment
    - Sect. 5.6 Acoustic Noise Test

Ordering Information

  • PT-AMP5085-12148
    - Two CPC6600s
    - Two 5-port rear transition modules (RTM)
    - Six 250 W AC supplies
    - Two ISMs
    - ISM RTM
    - Air management blade
  • PT-AMP-5085-12149
    - Two CPC6600s
    - Two 5-port RTMs
    - Six 325 W DC supplies
    - Two ISMs
    - ISM RTM
    - Air management blade
  • PT-AMP5085-12150
    - Two CPC4416s
    - Two 5+2-port RTMs
    - Six 250 W AC supplies
    - Two ISMs
    - ISM RTM
    - Air management blade
  • PT-AMP5085-12151
    - Two CPC4416s
    - Two 5+2-port RTMs
    - Six 325 W DC supplies
    - Two ISMs
    - ISM RTM
    - Air management blade
  • PT-AMP5085-12227
    - Two CPC6600s
    - Two 5-port rear transition modules (RTM)
    - Six 300 W AC supplies
    - Two ISMs
    - ISM RTM
    - Air management blade
  • PT-AMP5085-12228
    - Two CPC4416s
    - Two 5+2-port RTMs
    - Six 300 W AC supplies
    - Two ISMs
    - ISM RTM
    - Air management blade

To discuss specific requirements and/or pricing, contact sales@pt.com.

RoHS & WEEE Compliant

All rights reserved. Specifications subject to change without notice. The names of actual companies, products, or services may be the trademarks, registered trademarks, or service marks of their respective owners in the United States and other countries.

 


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