MTC5070
1U MicroTCA™ Platform
- MTC5070: Platform Overview
- 1U MicroTCA™ Platform Supporting Up to Six AdvancedMC™ Modules
- Designed for Deployments in Telecom, Aerospace and Defense, Enterprise, and Commercial Applications
- Integrated Ethernet Switch with Dual 1 GbE Uplinks
- Integrated PCI-Express® Switch
- Integrated MicroTCA Carrier and Shelf Managers
The MTC5070 is a highly integrated 1U MicroTCA™-compliant platform that can support up to six mid-size, single AdvancedMC™ (AMC) modules. This fully deployable MicroTCA platform meets the needs for high-performance, cost-effective, and modular processing in low-profile, appliance-style applications. Both PCI-Express® and Ethernet switching are supported to each slot. Storage is accommodated by direct SATA/SAS slot-to-slot connections between the AMC sites. The onboard platform management subsystem provides MicroTCA compliant carrier and shelf management. Performance Technologies MicroTCA platform, AdvancedMC modules, and NexusWare® enabling software offers an optimized application-ready foundation for telecom, wireless, aerospace and defense, and commercial applications.
Highly Integrated Architecture
The MTC5070 platform architecture maximizes payload slot density in a 1U form factor, while minimizing overhead costs. Non-payload functions, such as the Ethernet switch, PCI-Express switch, carrier/shelf Manager, and power supplies, are integrated into the rear of the chassis, and are not designed as AMC-based modules, which add overhead costs in connectors and front panels, and consume valuable payload slot space.
Configuration and Details
The slot bay is flexible and supports all major AdvancedMC form factors, whether mid-size or full-size, single or double modules. Numerous configurations can be achieved with a mix of different AMC form factors. For example, the MTC5070 can support up to six mid-size, single AdvancedMC modules, or one full-size, double and two mid-size, single modules.
The MTC5070 features front-to-back cooling, which is critical for NEBS installations, with both push and pull fans to cool up to 40 W per mid-size, single slot. AC input or DC input options are available with a removable 300 W power supply.
The front I/O panel features LEDs (in-service, out-of-service, and user-defined), a reset switch, and a platform management console port.
The rear panel has dual 10/100/1000 Mb Ethernet uplink ports, a 10/100 Mb Ethernet out-ofband platform management port, power input, and a power switch.
Performance Technologies offers cost-effective and high-performance AdvancedMC modules such as the x86 processor modules (AMC111 and AMC121), PowerPC® processor modules (AMC131), storage/video module (AMC590), and synchronous 4 port WAN Communications module (AMC335).
Flexible Slot Configurations (6 mid-size, single payload slots)
The MTC5070 features six AdvancedMC payload sites. These sites can accept numerous AMC form factors:
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Each tier 2 AMC site can support a full-size, single AMC module. Similarly, double modules may be installed by removing struts from the carrier.
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Example Configurations
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Front-to-Rear Cooling Subsystem
The MTC5070 features front to back cooling. This is especially critical in NEBS specified installations. The front fan assembly (4 fans) pushes air through the AMCs, while the rear fan assembly (4 fans) pulls the air through the chassis and exhausts out the rear. Some of the air intake is routed to the power supply, which has its own fan. A removable air intake grill located in the front of the chassis allows for routine replacement of a NEBS specified filter. Each slot receives an ample airflow of 1500 LFM to ensure cooling of up to 40W per mid-size slot. |
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Power Subsystem The system power is provided by a removable 300W intelligent power supply that is monitored by the platform management subsystem. It delivers up to 40W of 12V payload power and 3.3V management power to each AMC site. Two input options are available; AC or DC. There is also an inhibit switch on the rear panel connected to the power supply.
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Front Panel I/O
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Rear Panel I/O
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Comprehensive Platform Management Subsystem
The on-board platform management subsystem provides the complete shelf manager and carrier manager functions as specified in the MicroTCA.0 specification. The carrier manager monitors, manages, and controls the AMC payload boards and the active platform functions: Ethernet, PCI-Express, Telco clock, and power and cooling subsystems. The shelf manager communicates with the carrier manager and interfaces to external management systems using Remote Management Control Protocol (RMCP) via an out-of-band 10/100 Mb Ethernet port located in the rear of the chassis. A Command Line Interface (CLI) is accessible from the console port for local servicing.
AMC Management
The carrier manager monitors each AMC’s sensors (e.g. temperature, voltage, etc.), queries FRU information, and manages presence detection, slot power control, and AMC interface configuration. E-keying ensures that each AMC installed in the platform is compatible with the connected fabrics.
Power Supply and Cooling Management
The platform management subsystem connects to the power and cooling subsystems and monitors sensors (e.g. temperature, fan tachometers, etc) and manages fan speeds.
PCI-Express Subsystem
A x1 PCI Express (PCIe) link is connected to Port 4 of each AMC site. The root complex is located in the T2-S3 location. The PCIe subsystem in the MTC5070 supports hot plug capabilities (Presence Detect, and in-band link state change notification). The MTC5070 provides PCIe clock distribution to each AMC site, sourced from either the root complex AMC or from the MTC5070.
Ethernet Subsystem
The on-board Ethernet Switch provides a 1 Gb SERDES Ethernet link to Port 0 of each AMC site. Dual 10/100/1000 Mb Ethernet uplink ports are available on the rear panel (RJ45).
SAS/SATA Storage Subsystem
The MTC5070 supports up to two storage AMC modules, such as the AMC590. SATA/SAS channels are directly connected between the AMC sites within each tier from ports 2 and 3 on slot 3 of each tier to port 2 on slots 1 and 2 of their respective tier.
Technical Specifications
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Specifications subject to change without notice. The names of actual companies, products, or services may be the trademarks, registered trademarks, or service marks of their respective owners in the United States and other countries. |
